Under Announcement No. 30 (2025), issued in December 2025, HCFCs and HCFC-containing cleaning solvents will be banned from July 1, 2026. In response, Changzhou Jiayuan Chemical has introduced HFE-449

Release Date: July 3 2026 Source:

Fluorochemical Products R&D Center, Changzhou Jiayuan Chemical Co., Ltd.

Changzhou Jiayuan Chemical Co., Ltd. focuses on the field of fluorochemistry and has built a complete industrial chain from fluorite to high - purity hydrogen fluoride, electronic-grade hydrofluoric acid, trifluorochloroethylene, octafluorocyclobutane, inorganic fluoride salt series, boron-10 acid, electronic specialty gases, and downstream high-end fluorinated liquids (such as HFE449), truly achieving vertical integration throughout the AI big data market.

Changzhou Jiayuan Chemical Co., Ltd., relying on its self-controllable raw material advantages and large-scale production capabilities, can ensure stable product quality and reliable supply from source to finished product. The company's products are widely used in cutting-edge fields such as precision manufacturing cleaning, electronic heat dissipation and cooling, new energy, and semiconductor testing, and the company is committed to providing global customers with high-performance, low-environmental-impact fluorochemical solutions.

Changzhou Jiayuan Chemical Co., Ltd. will continue to focus on the fluorochemical industry chain, promote the technological iteration and industrialization of green fluorosolvents, and contribute to the sustainable development of the industry.

Currently, fluorinated ether-based fully cleaning solvents represented by HFE-449 (Hydrofluoroether / CAS: 993-95-3) modify conventional ODS cleaning structures step by step, becoming a key method variable that immediately affects yield and overall performance in producing better electronics. With increasing environmental constraints, the section-out of ODS cleanup structures is equally accelerated.

1. Policy Tightening and Accelerated Substitution: ODS Phase-Out Enters a Clear Timeline

Under increasingly strict environmental regulations, the use of ODS and hydrochlorofluorocarbon (HCFC)-related systems has been further restricted.

According to a formal notice released by the competent environmental authority in December 2025 (Notice No. 30 of 2025), from July 1, 2026, the use of HCFC-containing substances or HCFC-based blended solvents as cleaning agents will be prohibited.

This regulatory signal indicates that:

·Traditional ODS/HCFC cleaning systems are entering a definitive phase-out stage

·Electronics manufacturing cleaning processes must undergo systematic substitution

·Replacement solutions are required not only for compliance, but also for yield stability and process reliability

Against this backdrop, HFE-based fluorinated ether solvents are gaining increasing attention.

2. Key Pain Points: Process Limitations of ODS Systems

In practical applications, ODS cleaning systems present several limitations in advanced electronics manufacturing:

·Insufficient cleaning coverage in fine-pitch structures such as BGA and QFN packages

·Limited residue control capability, increasing the risk of ionic contamination

·High energy consumption during drying, with potential secondary contamination risks

·Possible swelling or interfacial impact on certain packaging materials

·Narrow process window and unstable batch-to-batch consistency

These issues ultimately translate into yield fluctuations and reliability risks at the manufacturing level.

3. ODS vs HFE-449: Key Performance Comparison

HFE-449 follows a distinctly different process route as a replacement cleaning solvent. Taking the HFE-449 supplied by Changzhou Jiayuan Chemical as an example, the product features a purity of ≥99.85% and a Global Warming Potential (GWP) of 33, providing a well-balanced combination of environmental compliance and process performance. In addition, testing indicates a specific heat capacity of 1.281 J/g·K and a thermal conductivity of 0.110 W/(m·K). These thermal properties enable stable heat transfer during both precision cleaning and vapor degreasing, contributing to more uniform temperature control, minimizing cleaning performance fluctuations caused by localized temperature differences, and supporting consistent operation in continuous and high-volume manufacturing environments.

(1) Environmental Compliance Pathway

·ODS/HCFC systems: facing phased restriction and substitution pressure

·HFE-449: low GWP (33), aligned with low-carbon development trends

Driven by regulatory policies, HFE-449 offers a clearer long-term application outlook.

(2) Cleaning Mechanism Differences

·ODS systems: mainly rely on dissolution-based cleaning, with limited penetration into microstructures

·HFE-449 system: low surface tension penetration combined with rapid evaporation for contaminant removal

This mechanism makes HFE-449 more suitable for high-density packaging and precision electronic structures.

(3) Material Compatibility and Equipment Reliability

Beyond cleaning efficiency, electronics manufacturers also place significant emphasis on the long-term compatibility of cleaning solvents with production equipment and electronic component materials. Corrosion testing of Changzhou Jiayuan Chemical’s HFE-449 demonstrates low mass loss across a range of commonly used engineering metals:

Copper: 3.2 mg/specimen

Brass: 2.8 mg/specimen

Steel: 1.6 mg/specimen

Cast iron: 2.9 mg/specimen

Solder: 6.4 mg/specimen

Cast aluminum: 2.6 mg/specimen

Overall, the test results indicate consistently low corrosion levels across the evaluated metal substrates, demonstrating the excellent material compatibility of Changzhou Jiayuan Chemical's HFE-449. In practical electronics manufacturing applications, this helps minimize the risk of solvent-induced corrosion to electronic components, printed circuit boards (PCBs), electrical connectors, and cleaning equipment. As a result, it reduces maintenance requirements, improves process reliability, and contributes to longer equipment service life during long-term operation.

(4) Process Performance and Yield Impact

·ODS systems: significant residue variation and unstable drying consistency

·HFE-449 systems: lower residue levels and improved process stability

In practical process optimization, the overall manufacturing yield improvement is approximately 1.5%, mainly driven by:

·Reduced particulate contamination

·Lower risk of solder joint defects (such as cold solder joints)

·Improved post-inspection defect rates

4. Application Significance: Cleaning Processes Reshaping Yield Structure

The role of cleaning processes in electronics manufacturing is evolving. Rather than being a simple “contamination removal step”, it is increasingly becoming a critical factor influencing overall yield structure.

The practical value of HFE-449 is mainly reflected in:

·Improved consistency in microstructure cleaning

·Reduced latent defects caused by residue

·Stabilized process variation across production batches

From a manufacturing perspective, this represents a system-level improvement rather than a single-point optimization.

5. Conclusion

As ODS-based cleaning solvents are phased out, the electronics industry is adopting more stable and reliable cleaning technologies. Changzhou Jiayuan Chemical's HFE-449, a next-generation hydrofluoroether (HFE) cleaning solvent, delivers excellent thermophysical properties, material compatibility, and cleaning performance, helping manufacturers optimize processes and improve production yields.

For technical specifications of HFE-449, utility answers, or more data on pattern assessment, please contact Changzhou Jiayuan Chemical. Our technical team is to provide specified product facts, application guidance, and custom designed technical assistance on your particular production requirements.